Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11066753 | Plated polymeric article including tin/copper tie/seed layer | Larry S. Hebert, David A. Sowatzke, Gene B. Nesmith | 2021-07-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11066753 | Plated polymeric article including tin/copper tie/seed layer | Larry S. Hebert, David A. Sowatzke, Gene B. Nesmith | 2021-07-20 |