Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847517 | Method for forming semiconductor device having a multi-thickness gate trench dielectric layer | Ger-Pin Lin, Tien-Chen Chan, Shu-Yen Chan | 2020-11-24 |
| 10797157 | Semiconductor device and method for fabricating the same | Fu-Jung Chuang, Chia-Ming Kuo, Po-Jen Chuang, Chi-Mao Hsu | 2020-10-06 |
| 10658369 | Semiconductor device and method for fabricating the same | Kun-Hsin Chen, Hsuan-Tung Chu, Po-Chun Chen | 2020-05-19 |