Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861763 | Thermal routing trench by additive processing | Benjamin Stassen Cook, Archana Venugopal, Luigi Colombo | 2020-12-08 |
| 10811334 | Integrated circuit nanoparticle thermal routing structure in interconnect region | Benjamin Stassen Cook, Archana Venugopal, Luigi Colombo | 2020-10-20 |
| 10790228 | Interconnect via with grown graphitic material | Archana Venugopal, Benjamin Stassen Cook, Luigi Colombo | 2020-09-29 |
| 10529641 | Integrated circuit nanoparticle thermal routing structure over interconnect region | Archana Venugopal, Benjamin Stassen Cook, Luigi Colombo | 2020-01-07 |