Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10860061 | Electronic device with bonding structure | Daehyeong Park, Jongmin CHOI, Jongkeun KIM, Hun KIM, Donghyun BYUN +8 more | 2020-12-08 |
| 10709051 | Electronic device including component separation structure | Sung-Gun Cho, Daehyeong Park, Jong Min Choi, Hyunjong LEE, Uyhyeon Jeong +2 more | 2020-07-07 |