| 10847507 |
Contact liner to enable different CPP devices |
Stanley Seungchul Song, Jie Deng, Giridhar Nallapati |
2020-11-24 |
| 10833017 |
Contact for semiconductor device |
Yanxiang Liu, Haining Yang, Youseok Suh, Jihong Choi |
2020-11-10 |
| 10686031 |
Finger metal-oxide-metal (FMOM) capacitor |
Peijie Feng, Ye Lu, Giridhar Nallapati |
2020-06-16 |
| 10665678 |
Transistor with fluorinated graphene spacer |
Ye Lu, Bin Yang, Lixin Ge, Yun Yue |
2020-05-26 |
| 10651122 |
Integrated circuit (IC) interconnect structure having a metal layer with asymmetric metal line-dielectric structures supporting self-aligned vertical interconnect accesses (VIAS) |
Giridhar Nallapati, Periannan Chidambaram |
2020-05-12 |
| 10636789 |
Transistor with low resistivity carbon alloy |
Ye Lu, Bin Yang, Lixin Ge, Yun Yue |
2020-04-28 |
| 10636737 |
Structure and method of metal wraparound for low via resistance |
Jie Deng, John Jianhong Zhu, Giridhar Nallapati |
2020-04-28 |
| 10615113 |
Rotated metal-oxide-metal (RTMOM) capacitor |
Xia Li, Bin Yang, Gengming Tao |
2020-04-07 |
| 10566413 |
MIM capacitor containing negative capacitance material |
Ye Lu, Bin Yang |
2020-02-18 |