Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847385 | Glob top encapsulation using molding tape | Wiwat Tanwongwan, Nathapop Lappanitpullpol | 2020-11-24 |
| 10790220 | Press-fit semiconductor device | Chayathorn Saklang, Stephen R. Hooper, Chanon Suwankasab, Bernd Offermann, James Lee Grothe +1 more | 2020-09-29 |
| 10763203 | Conductive trace design for smart card | Wiwat Tanwongwan, Nathapop Lappanitpullpol | 2020-09-01 |