Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10816280 | Integrated multi-chamber heat exchanger | Ryan M. Alderfer, Matthew D. Miller | 2020-10-27 |
| 10548243 | Process for installing an insert for fluid-flow-through cooling of circuit boards | Brian Kaplun, James S. Eiche | 2020-01-28 |
| 10527362 | Integrated multi-chamber heat exchanger | Ryan M. Alderfer, Matthew D. Miller | 2020-01-07 |