Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10875127 | Method for bonding electronic component and method for manufacturing bonded body | — | 2020-12-29 |
| 10707388 | Semiconductor device, and method for manufacturing semiconductor device | Masafumi Kuramoto | 2020-07-07 |
| 10593851 | Metal powder sintering paste, method for producing the same, and method for producing conductive material | Masafumi Kuramoto | 2020-03-17 |