Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700041 | Stacking of three-dimensional circuits including through-silicon-vias | — | 2020-06-30 |
| 10692836 | Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration | — | 2020-06-23 |
| 10580749 | Semiconductor device and method of forming high routing density interconnect sites on substrate | — | 2020-03-03 |