Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643913 | Apparatus and mechanisms for reducing warpage and increasing surface mount technology yields in high performance integrated circuit packages | Woon-Seong Kwon, Michael T. Wise | 2020-05-05 |
PL
Phillip La
Overall (2020): #314,866 of 565,922Top 60%
1
Patents 2020