Issued Patents 2020
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10870220 | Chuck table and processing apparatus including the same | — | 2020-12-22 |
| 10872791 | Tape attaching method and tape attaching apparatus | — | 2020-12-22 |
| 10854462 | Wafer processing method | — | 2020-12-01 |
| 10847398 | Chuck table correction method and cutting apparatus | — | 2020-11-24 |
| 10843313 | Chuck table mechanism | — | 2020-11-24 |
| 10843304 | Cutting blade supplying apparatus | — | 2020-11-24 |
| 10826456 | Method of manufacturing surface acoustic wave device chips | — | 2020-11-03 |
| 10818546 | Method of laser-processing device wafer | — | 2020-10-27 |
| 10809105 | Measuring instrument and processing apparatus | — | 2020-10-20 |
| 10782530 | Information transfer mechanism for processing apparatus for displaying notice information to an operator | — | 2020-09-22 |
| 10759088 | Cutting blade mounting method | — | 2020-09-01 |
| 10763172 | Method of processing wafer | — | 2020-09-01 |
| 10717605 | Conveyance system | — | 2020-07-21 |
| 10692767 | Wafer processing method including cutting wafer based on surface height of wafer | — | 2020-06-23 |
| 10668595 | Method of using laminated dressing board | — | 2020-06-02 |
| 10576608 | Dressing board, cutting blade dressing method, and cutting apparatus | — | 2020-03-03 |
| 10569442 | Cutting blade mounting mechanism | — | 2020-02-25 |
| 10562207 | Wafer processing method | Shigenori Harada, Motoki Ishikawa, Takaaki Inoue | 2020-02-18 |
| 10532445 | Processing apparatus and processing method for workpiece | — | 2020-01-14 |