Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665570 | Stack packages including through mold vias | Jae-Hoon Lee, Bok Kyu CHOI | 2020-05-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665570 | Stack packages including through mold vias | Jae-Hoon Lee, Bok Kyu CHOI | 2020-05-26 |