Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10588219 | Metallized particle interconnect with solder components | Layne A. Berge, John R. Dangler, Matthew S. Doyle | 2020-03-10 |
JH
Jesse Hefner
Overall (2020): #426,238 of 565,922Top 80%
1
Patents 2020