Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10573579 | Semiconductor package with improved heat dissipation | Tai-Yu Chen, Wen-Sung Hsu, Sheng-Liang Kuo, Chi-Wen Pan | 2020-02-25 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10573579 | Semiconductor package with improved heat dissipation | Tai-Yu Chen, Wen-Sung Hsu, Sheng-Liang Kuo, Chi-Wen Pan | 2020-02-25 |