Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672625 | Electronic device package with recessed substrate for underfill containment | Joshua D. Heppner, Jimin Yao | 2020-06-02 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672625 | Electronic device package with recessed substrate for underfill containment | Joshua D. Heppner, Jimin Yao | 2020-06-02 |