Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727160 | Thermal management component | Devdatta P. Kulkarni, Richard J. Dischler | 2020-07-28 |
| 10600699 | Apparatus for inspection of a package assembly with a thermal solution | Aastha Uppal, Shankar Devasenathipathy, Joseph B. Petrini | 2020-03-24 |