Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10566215 | Method of fabricating a chip module with stiffening frame and orthogonal heat spreader | Evan G. Colgan, Hilton T. Toy, Jeffrey A. Zitz | 2020-02-18 |
YP
Yi Pan
Overall (2020): #214,974 of 565,922Top 40%
1
Patents 2020