Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833016 | Semiconductor device including superconducting metal through-silicon-vias and method of making the same | David W. Abraham | 2020-11-10 |
| 10734567 | Bump bonded cryogenic chip carrier | David W. Abraham, Mary B. Rothwell | 2020-08-04 |
| 10727192 | Multiple sized bump bonds | David W. Abraham | 2020-07-28 |
| 10727391 | Bump bonded cryogenic chip carrier | David W. Abraham, Mary B. Rothwell | 2020-07-28 |
| 10651099 | Non-destructive testing of integrated circuit chips | David W. Abraham | 2020-05-12 |
| 10629797 | Two-component bump metallization | David W. Abraham, Eric P. Lewandowski | 2020-04-21 |
| 10608158 | Two-component bump metallization | David W. Abraham, Eric P. Lewandowski | 2020-03-31 |