Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10625257 | Direct bond transfer layers for manufacturable sealing of microfluidic chips | Joshua T. Smith, Chao Wang, Benjamin H. Wunsch | 2020-04-21 |
CT
Cornelia K. Tsang
Overall (2020): #506,964 of 565,922Top 90%
1
Patents 2020