Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833089 | Buried conductive layer supplying digital circuits | Juergen Pille, Tobias Werner, Rolf Sautter, Dieter Wendel | 2020-11-10 |
| 10804266 | Microelectronic device utilizing stacked vertical devices | Juergen Pille, Tobias Werner, Rolf Sautter, Dieter Wendel | 2020-10-13 |
| 10586006 | Build synthesized soft arrays | Thomas Kalla, Juergen Pille, Philipp Salz | 2020-03-10 |