Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818567 | Integrated circuit substrate for containing liquid adhesive bleed-out | Woon-Seong Kwon, Ryohei Urata | 2020-10-27 |
| 10681846 | Cooling electronic devices in a data center | Madhusudan K. Iyengar, Christopher G. Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon +1 more | 2020-06-09 |
| 10658322 | High bandwidth memory package for high performance processors | Woon-Seong Kwon, Nam Hoon Kim | 2020-05-19 |
| 10548239 | Cooling electronic devices in a data center | Madhusudan K. Iyengar, Gregory Sizikov, Yuan Li, Jorge Padilla, Woon-Seong Kwon | 2020-01-28 |
| 10548240 | Cooling electronic devices in a data center | Madhusudan K. Iyengar, Christopher G. Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon +1 more | 2020-01-28 |