Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861716 | Processing method for package substrate | Byeongdeck Jang | 2020-12-08 |
| 10707176 | Method of manufacturing semiconductor package | — | 2020-07-07 |
| 10700014 | Method of manufacturing semiconductor package | — | 2020-06-30 |
| 10586699 | Method of assessing semiconductor substrate and method of assessing device chip | Shoichi Kodama | 2020-03-10 |