Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10860776 | Printed circuit board (PCB) modular design | Hing Y. To, John J. Rinck, Juan Wang | 2020-12-08 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10860776 | Printed circuit board (PCB) modular design | Hing Y. To, John J. Rinck, Juan Wang | 2020-12-08 |