Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763234 | Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer | Chi-Yu Wang | 2020-09-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763234 | Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer | Chi-Yu Wang | 2020-09-01 |