Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10513431 | Multiple silicon trenches forming method for MEMS sealing cap wafer and etching mask structure thereof | Yongxiang Wen, Chen Liu, Feng Ji | 2019-12-24 |
| 10183699 | Multiple stage deformation reinforcement structure for impact absorption | Henry E. Richardson | 2019-01-22 |
| 10173727 | Multiple stage deformation reinforcement structure for impact absorption | Henry E. Richardson | 2019-01-08 |