Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522405 | Method of processing workpiece including cutting step that uses cutting fluid with organic acid and oxidizing agent to reduce ductility of layered bodies containing metal | — | 2019-12-31 |
| 10468302 | Workpiece processing method | — | 2019-11-05 |
| 10424511 | Method of processing workpiece | — | 2019-09-24 |
| 10403519 | Cutting blade having cutting edge containing photocatalyst particles | — | 2019-09-03 |
| 10388534 | Method of processing workpiece | — | 2019-08-20 |
| 10354893 | Cutting apparatus and wafer cutting method | — | 2019-07-16 |
| 10283410 | Method of processing workpiece | — | 2019-05-07 |