Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10374129 | Compound semiconductors having an improved high temperature resistant backside metallization | Chang-Hwang Hua, Shu-Chen Chen, Huang-Wen Wang | 2019-08-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10374129 | Compound semiconductors having an improved high temperature resistant backside metallization | Chang-Hwang Hua, Shu-Chen Chen, Huang-Wen Wang | 2019-08-06 |