Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381303 | Semiconductor device structures | Ting-You Lin | 2019-08-13 |
| 10256201 | Bonding pad structure having island portions and method for manufacturing the same | Hung-Wei Chen, Shi-Hsiang Lu, Ching-Wen Wang | 2019-04-09 |