Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10487183 | Method of bonding substrates and method of producing microchip | Fumitoshi Takemoto, Shinji Suzuki, Motohiro Sakai | 2019-11-26 |
| 10420221 | Wiring board desmear treatment method | Makoto WASAMOTO, Shinichi Endo | 2019-09-17 |
| 10351288 | Paper sheets pre-processing apparatus | Kazuhiro Mukai, Masahiro Nagao, Junichi Inoue, Toshinori Utsugi, Osamu Maruyama | 2019-07-16 |