Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297446 | Encapsulated substrate, manufacturing method, high band-gap device having encapsulated substrate | Hsiao-Lei Wang, Po-Yen Liu | 2019-05-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297446 | Encapsulated substrate, manufacturing method, high band-gap device having encapsulated substrate | Hsiao-Lei Wang, Po-Yen Liu | 2019-05-21 |