Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10458958 | Ultrasonic through-thickness modulus evaluation of materials | Ming-Yung Chen | 2019-10-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10458958 | Ultrasonic through-thickness modulus evaluation of materials | Ming-Yung Chen | 2019-10-29 |