Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312235 | Method of forming fin shape structure having different buffer layers | Wen-Yin Weng, Cheng-Tung Huang, Wei-Heng Hsu, Yu-Ming Lin | 2019-06-04 |
| 10283497 | Light-emitting diode chip | Shiou-Yi KUO, Chao-Hsien Lin | 2019-05-07 |