Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497607 | Manufacturing method of interconnect structure | Li-Han Chen, Chun-Chieh Chiu, Yen-Tsai Yi | 2019-12-03 |
| 10497617 | Conductive structure and method for manufacturing conductive structure | Li-Han Chen, Yen-Tsai Yi, Chun-Chieh Chiu, Min-Chuan Tsai, Hsin-Fu Huang | 2019-12-03 |
| 10199269 | Conductive structure and method for manufacturing conductive structure | Li-Han Chen, Yen-Tsai Yi, Chun-Chieh Chiu, Min-Chuan Tsai, Hsin-Fu Huang | 2019-02-05 |
| 10192826 | Conductive layout structure including high resistive layer | Kun-Ju Li, Kuo-Chin Hung, Min-Chuan Tsai, Yi-Han Liao, Chun-Tsen Lu +2 more | 2019-01-29 |