Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497704 | Buried word line structure and method of making the same | Ger-Pin Lin, Kuan-Chun Lin, Chi-Mao Hsu, Shu-Yen Chan, Shih-Fang Tzou +4 more | 2019-12-03 |
| 10373958 | Semiconductor device having a multi-thickness gate trench dielectric layer | Ger-Pin Lin, Tien-Chen Chan, Shu-Yen Chan | 2019-08-06 |
| 10217750 | Buried word line structure and method of making the same | Ger-Pin Lin, Kuan-Chun Lin, Chi-Mao Hsu, Shu-Yen Chan, Shih-Fang Tzou +4 more | 2019-02-26 |
| 10204788 | Method of forming high dielectric constant dielectric layer by atomic layer deposition | Shan Ye, Shih-Cheng Chen, Tzu-Hsiang Su, Po-Jen Chuang | 2019-02-12 |