Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504821 | Through-silicon via structure | Chu-Fu Lin, Kuei-Sheng Wu | 2019-12-10 |
| 10340231 | Semiconductor package structure and method for forming the same | Chun-Hung Chen, Chu-Fu Lin | 2019-07-02 |
| 10325873 | Chip-stack structure | — | 2019-06-18 |
| 10192808 | Semiconductor structure | Teng-Chuan Hu, Chun-Hung Chen, Chu-Fu Lin, Chun-Ting Yeh, Chung-Hsing Kuo | 2019-01-29 |