Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312207 | Passivation scheme for pad openings and trenches | Ming-Hong Chang, Chun-Yi Yang, Kun-Ming Huang, Po-Tao Chu, Shen-Ping Wang | 2019-06-04 |
| 10276651 | Low warpage high density trench capacitor | Jyun-Ying Lin, Hsin-Li Cheng, Jing-Hwang Yang, Felix Ying-Kit Tsui | 2019-04-30 |
| 10199273 | Method for forming semiconductor device with through silicon via | Yung-Chang Lin | 2019-02-05 |