Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10395946 | Electronic package and manufacturing method thereof | — | 2019-08-27 |
| 10373918 | Package substrate | — | 2019-08-06 |
| 10304786 | Composite carrier for warpage management | — | 2019-05-28 |
| 10304794 | Manufacturing method of integrated circuit package | — | 2019-05-28 |
| 10290586 | Package substrate with embedded noise shielding walls | — | 2019-05-14 |
| 10283455 | Manufacturing method of package structure having embedded bonding film | — | 2019-05-07 |
| 10236245 | Package substrate with embedded circuit | — | 2019-03-19 |
| 10224300 | Pad structure and manufacturing method thereof | — | 2019-03-05 |