Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10433413 | Manufacturing method of circuit structure embedded with heat-dissipation block | Ming-Chia Li | 2019-10-01 |
| 10314179 | Manufacturing method of circuit structure | Hung-Lin Chang, Ming-Hao Wu, Syun-Siao Chang, Chi-Min Chang | 2019-06-04 |