Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10451969 | Resin composition, method for manufacturing semiconductor element using the same, and semiconductor device | Yugo Tanigaki | 2019-10-22 |
| 10409163 | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device | Yugo Tanigaki | 2019-09-10 |
| 10177022 | Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition | Shinji Arimoto, Masao Tomikawa | 2019-01-08 |