Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10167190 | Low cost wafer level process for packaging MEMS three dimensional devices | Andrei A. Shkel, Doruk Senkal | 2019-01-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10167190 | Low cost wafer level process for packaging MEMS three dimensional devices | Andrei A. Shkel, Doruk Senkal | 2019-01-01 |