Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453706 | Methods and devices for miniaturization of high density wafer based electronic 3D multi-chip modules | Justin C. Borski | 2019-10-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453706 | Methods and devices for miniaturization of high density wafer based electronic 3D multi-chip modules | Justin C. Borski | 2019-10-22 |