Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483659 | Grounding clip for bonded vanes | David R. Lyders, Nicholas D. Stilin | 2019-11-19 |
| 10294817 | Method to integrate multiple electric circuits into organic matrix composite | David R. Lyders, Marc E. Holyfiield | 2019-05-21 |