Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418504 | Bonding using conductive particles in conducting adhesives | — | 2019-09-17 |
| 10340401 | Multi-layer back surface field layer in a solar cell structure | Xing-Quan Liu, Daniel C. Law, Christopher M. Fetzer, Richard R. King | 2019-07-02 |
| 10250023 | Two-part snap-together feedthroughs | Dale H. Waterman, John S. Frost, John F. Suarez, Kristina I. Kassem, Jonah C. Huffman | 2019-04-02 |
| 10177265 | Bonding using conductive particles in conducting adhesives | — | 2019-01-08 |