Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381293 | Integrated circuit package having an IC die between top and bottom leadframes | Lee Han Meng@Eugene Lee, Chong Han Lim | 2019-08-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381293 | Integrated circuit package having an IC die between top and bottom leadframes | Lee Han Meng@Eugene Lee, Chong Han Lim | 2019-08-13 |