Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10384325 | Dual-thickness backgrinding tape for backgrinding bumped wafers | Jeniffer Viera Otero, Mark Daniel Pabalate Minoc, Cherry Lyn Marquez Aranas, Russel Rosales Borreo | 2019-08-20 |