Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418294 | Semiconductor device package with a cap to selectively exclude contact with mold compound | Jerry Gomez Cayabyab | 2019-09-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418294 | Semiconductor device package with a cap to selectively exclude contact with mold compound | Jerry Gomez Cayabyab | 2019-09-17 |