Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490547 | IC with larger and smaller width contacts | Guruvayurappan Mathur, Poornika Fernandes | 2019-11-26 |
| 10438837 | Anneal after trench sidewall implant to reduce defects | Bradley David Sucher, Bernard John Fischer | 2019-10-08 |
| 10439020 | In-situ plasma treatment for thin film resistors | Dhishan Kande, Qi-Zhong Hong, Shih Chang Chang | 2019-10-08 |
| 10361095 | Metal interconnect processing for an integrated circuit metal stack | Dhishan Kande, Qi-Zhong Hong, Young-Joon Park, Kyle McPherson | 2019-07-23 |
| 10354951 | Thin film resistor with punch-through vias | Dhishan Kande, Qi-Zhong Hong, Gregory B. Shinn | 2019-07-16 |
| 10211278 | Device and method for a thin film resistor using a via retardation layer | Dhishan Kande, Qi-Zhong Hong | 2019-02-19 |
| 10211096 | Semiconductor product and fabrication process | Hong-Seon Yang, Yaping Chen, Chao Zuo, Seetharaman Sridhar, Yunlong Liu | 2019-02-19 |
| 10177214 | Metal thin film resistor and process | Eric Beach | 2019-01-08 |