Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510653 | Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect | Chee Wah Cheung | 2019-12-17 |
| 10468342 | Formation of fine pitch traces using ultra-thin PAA modified fully additive process | Chee Wah Cheung | 2019-11-05 |
| 10362680 | Patterning of graphene circuits on flexible substrates | Chee Wah Cheung | 2019-07-23 |