Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10195697 | Palladium (Pd)-coated copper wire for ball bonding | Hiroyuki Amano, Somei Yarita, Yusuke SAKITA, Wei CHEN | 2019-02-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10195697 | Palladium (Pd)-coated copper wire for ball bonding | Hiroyuki Amano, Somei Yarita, Yusuke SAKITA, Wei CHEN | 2019-02-05 |