Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10456872 | Lead-free solder alloy, electronic circuit substrate, and electronic device | Masaya Arai, Takeshi Nakano, Atsushi Hori, Yurika Munekawa | 2019-10-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10456872 | Lead-free solder alloy, electronic circuit substrate, and electronic device | Masaya Arai, Takeshi Nakano, Atsushi Hori, Yurika Munekawa | 2019-10-29 |